PCBA Assembly

Turnkey Electronics Manufacturing

    — From component sourcing to final box build. We deliver IPC-A-610 certified assemblies with full traceability, rapid prototyping, and scalable volume production.

 

Core Assembly Capabilities

1 – SMT Assembly

–0201 to QFP/BGA/CSP · 0.3mm pitch · Dual-sided placement · 120k+ points/hour capacity

2 – Through-Hole (THT)

–Selective wave soldering · Manual insertion · Press-fit connectors · High-reliability automotive/industrial

3 – Conformal Coating

–Acrylic/Silicone/Urethane/Parylene · Selective masking · IPC-CC-830B compliance · Humidity/chemical resistance

4 – Box Build & Final Assembly

–Cable harnessing · Enclosure integration · Firmware flashing · Functional testing & packaging

5 – End-to-End Assembly Workflow

–Six-phase controlled process with 100% traceability from incoming inspection to final shipment.

6 – Component Sourcing & IQC

–Authorized distributor network, counterfeit detection, moisture control (MSL).

7 – Solder Paste & SPI

–Auto-stenciling, 3D solder paste inspection, volume/alignment verification.

8 – Pick & Place + Reflow

–Nitrogen reflow profiling, fine-pitch BGA/QFN, lead-free RoHS process.

9 – AOI & X-Ray Inspection

–Automated optical inspection, BGA void analysis, solder joint validation.

10 – ICT & FCT Testing

–Custom fixtures, power-on test, firmware loading, burn-in aging.

11 – Packaging & Logistics

–ESD-safe packing, barcoded traceability, global freight & customs docs.

 

Quality & Sourcing

Supply Chain Security & Zero-Defect QC

–Component shortages and counterfeit risks are the #1 bottleneck in PCBA. We mitigate both through verified distributor partnerships, incoming XRF testing, and strict MSL handling protocols.

1 – 100% Traceable Lot Records (ERP Integrated)

2 – X-Ray Fluorescence (XRF) & Decapsulation Testing

3 – IPC-A-610 Class 2/3 Workmanship Standards

4 – ESD-Controlled Floors, Humidity & Temp Monitoring