PCB Fabrication

Core Fabrication Capabilities

 

Layer & Material

1-32 Layers · FR-4 / High-Tg / Rogers / Polyimide / Aluminum / Ceramic

Precision & Tolerance

Min Track/Space: 2.5mil/2.5mil · Min Hole: 0.075mm (Laser) / 0.1mm (Mechanical)

Surface Finishes

ENIG · OSP · HASL (Lead-Free) · Immersion Silver/Tin · Hard Gold (Edge Fingers)

Impedance Control

Single/Differential/Stripline · ±5% / ±10% Tolerance · Time-Domain Reflectometry (TDR) Verification

 

Standardized Manufacturing Workflow

–Eight-step traceable process ensures consistency from CAM engineering to final packaging.

1-CAM & DFM Review

Gerber validation, stack-up simulation, tolerance check.

2-Inner Layer & Lamination

Photoresist imaging, etching, vacuum pressing, drilling.

3-Plating & Outer Imaging

Electroless copper, pattern plating, solder mask application.

4-Finish, Routing & Testing

Surface finish, depaneling, 100% electrical test & AOI.

 

Zero-Defect Quality Control

–Every board undergoes multi-stage inspection before leaving our facility. We adhere strictly to IPC-A-600 Class 2/3 standards and maintain full lot traceability.

100% Flying Probe / Fixture Electrical Test

AOI + X-Ray for Blind/Buried Vias

Cross-Section Analysis & Thermal Stress Test

Vacuum Packaging with Moisture Indicator Cards